Partner | Nationality | Type | Relevant Activity |
Academic | Coordinator University of Glasgow RTD research (device and circuit design, process development) |
||
Large Industrial | Nokia Component manufacturer (optical/wireless network equipment) |
||
R&D | CEA-LETI III-V on Si wafer bonding research |
||
SME | CST Global Component manufacture (III-V based devices) |
||
R&D | III-V Lab III-V on Si research (design, processing and validation) |
||
R&D | INESC TEC Wireless/optical communications research |
||
Large Industrial | IQE Silicon Compounds Wafer manufacturing (III-V on Si epitaxial growth) |
||
SME | Optocap Component manufacture (packaging solutions) |
||
Academic | TU Braunschweig mm-wave and THz wireless communications research |
||
Academic | University of Lisbon RTD research (design, modelling and characterisation) (from 01-Nov-2017) |
||
Academic | CEOT Algarve RTD research (design, modelling and characterisation) (to 01-Nov-2017) |
||
SME | Vivid Components Project management |