Newsletters

Newsletters will be issued approx. every six months.

Newsletter #4 (Dec-2016)

Topics in this newsletter are:

  • iBROW at European Microwave Week (London; Oct-2016)
  • III-V on Si wafer bonding for RTD processing from CEA-LETI
  • First reported RTDs on direct growth silicon wafers from IQE
  • Integrated antenna design and simulation from INESC TEC
  • iBROW input to standards for wireless comms led by TU Braunschweig
Newsletter #3 (Sep-2016)
This edition includes:

  • iBROW at European Microwave Week (Oct-2016)
  • Modelling of RTDs (University of Algarve)
  • Packaging high speed RTD and laser devices (Optocap)
  • Reducing thread dislocation density (IQE)
  • III-V on Si wafer bonding for RTD processing (CEA-LETI & III-V Lab)
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Newsletter #2 (Feb-2016)
This edition includes the following topics:

  • Heterogeneous integration in the context of iBROW
  • Laser characterisation and development work at CST
  • Laser measurement and simulation at INESC TEC.
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Newsletter #1 (Sep-2015)
This first newsletter includes:

  • An overview of RTD technology
  • News of record-breaking RTDs from University of Glasgow
  • THz standards work from TU Braunschweig
  • A preview of the ALT 2015 conference (07-11 Sep-2015; Faro, Portugal).
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